Focused on innovations in AOI, AI, and smart manufacturing to drive industry advancement.

●Leadership Experience: Over 2.5 years of leadership experience managing a team of 10 members. ●Market Development: Successfully developed new markets in the textile and passive component industries, achieving a market share of 60% and 65%, respectively. ●Revenue and Income Growth: Increased revenue by 50% and operating income by 60% in 2022. ●Product Innovation: Developed the CoWoS inner crack inspection system, boosting market share by 70%. ●AI Integration: Created AOI modules integrated with deep learning applications, resulting in a 99.99% improvement in yield rates for customers.

● Leadership Experience: 4 years of leadership experience managing a team of 5 members. ●Product Development: Developed the SiP inner crack inspection system, resulting in a 90% increase in product market share. ●Sales Achievement: Achieved a 45% increase in sales for WLCSP inspection machines. ●Cost Reduction: Reduced WLCSP product costs by approximately 30%. ●Market Expansion: Developed the line scan strip inspection system, leading to a 75% increase in product market share.

●Designed and Implemented AOI Module: Designed the AOI module, installed the machine, and conducted on-site testing. ●Semiconductor Projects: Developed the wafer-level CSP AOI project for ASECL and Amkor. ●Chemistry Projects: Developed the CMP pad project for Dupont.

● Algorithm Development: Coded algorithms for industry control protocol conversions (e.g., Modbus, Profibus). ● Software Interface Design: Designed the MFC software interface. ● Event Planning: Planned and organized the SPS Automation Exhibition in Nuremberg, Germany.