- Response for the symbol, trimming, forming, and reflow processes - Leading and fulfilling TI’s first 100% sampling AI inspection system - TI worldwide trim/form tool stability task force team member and the representative of TI Taiwan, leading 60%+ tool alarm reduction with 20+ actions within 1.5 years - Quality representative leading 30%+ QC reject reduction with 10+ actions within 1 year - TI Taiwan SPC lecture and course sharing - TI Taiwan DoE lecture and course sharing ◎ Award 2024 TI technical conference oral presenter in Dallas 2024 ECPLR - TI Taiwan, most potential Engineer - assigned as a worldwide boosting project leader 2022 Quality enhancement entitlement - TI Taiwan yearly customer commitment 1st award

- By using an 8D problem-solving process and Design of Experiments to overcome the silicon scratch defect caused by the silicon grinding wheel - By using 3L5W to solve the bump reflow non-form ball issue caused by mechanical failure ◎ Award 2021 TSMC lecturer award as department DoE expert Apply 2 trade secrets for the reflow process worth 280 million+ per year 2020 TSMC annual Continual Improvement Team (CIT) competition 3rd award for yield improvement worth 1.58 billion+ per year 2020 TSMC annual Design of Experiment (DoE) competition 3rd award