The process involves conducting thorough inspections of probe cards to ensure compliance with quality standards. Documentation review is also conducted, including certificates of compliance and test reports. Defect identification is done, and quality control is ensured. Data analysis is used to identify areas for improvement. Effective communication is provided, and continuous improvement initiatives are undertaken to enhance incoming inspection processes and supplier relationships.

The role involves coordinating the installation and commissioning of new semiconductor manufacturing equipment, ensuring it meets specifications and safety standards. Preventive maintenance plans are developed to minimize downtime and ensure reliability. Troubleshooting is performed to resolve issues like mechanical failures and software glitches. Process optimization is a collaborative effort with process engineers to improve yield, throughput, and quality. Continuous improvement is identified to enhance productivity, efficiency, and safety. Safety protocols, risk assessments, and training are implemented for personnel on safe equipment use.

Hardware and Prototype Assembly Overview • Used for EDS, wafer test process, final testing. • Assembles probe rings, cards, boards, test boxes, load board modules. • PCB layout components based on schematic diagram