Led team to define TI-Taiwan new package roadmap and strategy, as well as develop and introduce new packages with innovative ideas, robust quality, and cost competitive solutions to on-time release. Built strong connection with operation teams to smoothly and flawlessly launch complex devices and hit business goal. Served as TI-Taiwan leadership team to direct and decide factory strategy as well as mitigate business continuity risks. Organized and hosted worldwide meetings virtually with 120+ participants across 5+ time zones. Coached engineers to win top 3 paper among 100+ papers in worldwide conference in 3 consecutive years. Initiated and coached team to submit 36 IPs. 25 approved to file US patent. Developed top notch people in multiple nations by leveraging worldwide resource.

Led team to drive Taiwan quality strategy, build quality foundation and improve all quality indices. Served as site customer representative to successfully pass IATF-16949 internal and external audits from key customers. Led team to solve customer incidents and returns to receive high customer satisfaction across Assembly and Test process. Led cross-function teams to drive site quality excellence. Reduced low tech error cases. Improved indices of 6 chronic defects to record low by engineering breakthrough. Chair of MRB (Material Review Board) to direct risk assessment to protect quality to customers. Chair of CCB (Change Control Board) to drive the process change risk assessment with improved quality.

2005 Jun to 2009 Apr (Taiwan): Senior Wire Bond Packaging Engineer 2004 May to 2005 Apr (Dallas, TX): Packaging and Si node readiness Engineer 2003 Apr to 2004 May (Taiwan): Wire Bond Process Engineer