Tainan City, Taiwan・
Zhonghe District, New Taipei City, Taiwan・
Xinshi District, Tainan City, Taiwan 1.晶圓切割參數優化,調整切割速度搭配輪刀轉速良率上升>10%
2.與供應商共同測試新式切割刀應用新產品上提高客戶投片量
3.量產品異常調查分析,降低人為因素與異物殘留,宣導產線落實SOP手法,使每週異常率小於3次
4.導入新式雷射切割技術,搭配輪刀切割可提高產能>30%,因雷切光束窄增加切割道面積可大幅提高良率>20%
• Optimized wafer cutting parameters, adjusted cutting speed and wheel cutter speed to increase yield rate by >10%.
• Worked with suppliers to test new cutting knives and applied new products to increase customer wafer output.
• Investigated and analyzed mass product abnormalities, reduced human factors and foreign matter residues, and promoted the implementation of SOP techniques in the production line to ensure that the abnormality rate is less than 3 times per week.
• Introduced the new laser cutting technology, combined with wheel knife cutting to increase production capacity by >30%, the yield rate can be greatly improved by >20%.