Avatar of 潘書揚.
潘書揚
研發工程師
個人檔案
職場能力評價0

貼文
17個聯絡人
列印
Avatar of the user.

潘書揚

研發工程師
My name is “Shu-Yang Pan”, I enjoy meeting new people and finding way to help them have an uplifting experience. I had many varieties of work service experience. In those experience that I knew how to establish and maintain the proper business relationship with customers and peers as well as performing necessary administrative duties as required and other duties as assigned. Work Experience: Developer Engineer • Contrel Technology Oct. 2014 – Nov. 2016 • Implement, analyzes, diagnoses, evaluate and troubleshoots technical equipment problems, and support company systems in the field. • Maintain, support, and guide proper training to all users • Assist in new equipment integration, “add-ons,” and upgrades • Provide feedback to the headquarters based on experience gained with customers Process Engineer • Ying Han Technology Jan. 2017 - July 2018 • Development of five-axis laser cutting machine • Test parameters for cutting metal materials Process Engineer • ChipMOS Technology Oct. 2018 – Nov. 2019 • Test wafer cutting parameters • Investigate production line process abnormalities and propose improvements • Import new cutting process • Develop cost-reducing processes Developer Engineer • Photonicore Technology Feb. 2020 – Present • Develop fiber optic components • Development of high-power fiber laser • Developing high-power fiber optic amplifiers for space
萊凌科技股份有限公司
Logo of the organization.
國立嘉義大學
台灣
台灣

專業背景

  • 目前狀態
    就職中
  • 專業
    封裝工程師
    製程工程師
    硬體工程師
  • 產業
    硬體
    半導體
  • 工作年資
    6 到 10 年 (6 到 10 年相關工作經驗)
  • 管理經歷
  • 技能
    Word
    Excel
    PowerPoint
    Microsoft Office
    powerpoint
    Google Drive
    word
    Photoshop
  • 語言能力
    English
    中階
  • 最高學歷
    碩士

求職偏好

  • 目前狀態
  • 預期工作模式
    全職
    暫不考慮遠端工作
  • 希望獲得的職位
    工程師
  • 期望的工作地點
    台南市, 台灣
  • 接案服務
    不提供接案服務

工作經驗

技術工程師

2020年2月 - 現在
台南市, 台灣
1.封裝高功率光纖元件,經分析研究後解決光熱混合熱效應,已成功開發應用大於2000W光纖雷射系統內。 2.首批導入美商Lightel(6+1)x1光纖合束器side-pump技術,將製作參數以及手法優化後,使元件耦合光效率從90%提升至95%,Insertion Loss 從0.3dB降至0.15dB。 3.與工研院合作組裝高功率光纖雷射,波長1064nm輸出信號光功率達到2000W以上,優化光纖的熔接參數以及調整增益光纖的長度來減少非線性效應,光轉效率65%提升至70%。 4.開發光纖合數器封裝技術,使用特殊膠材將殘餘的散射光導引出,增加光導承受功率從單port 300W提高至450W 5.與成大航太所合作,開發太空用光纖合束器,經過超真空模擬驗證可使用於低軌道衛星 6.開發EYDFA低軌道衛星高功率光纖放大器,C Band頻寬增益數值>30dB • It encapsulates high-power optical fiber components and solves the thermal effect of light and heat mixing after analysis and research. It has been successfully developed and applied in fiber laser systems with power exceeding 2000W. • Optimized the production parameters and techniques, the component coupling light efficiency is increased from 90% to 95%, and the Insertion Loss is reduced from 0.3dB. to 0.15dB. • Cooperated with the Industrial Technology Research Institute to assemble a high-power fiber laser. Optimized the splicing parameters of the fiber and adjust the length of the gain fiber to reduce nonlinear effects. The optical conversion efficiency is increased from 65% to 70%. . • Developed optical fiber combiner packaging technology to increase the power of the light guide from 300W to 450W per port. • Developed EYDFA low-orbit satellite high-power fiber amplifier, C Band bandwidth gain value >30dB.
Logo of the organization.

Processing Engineer

2018年3月 - 2019年7月
1 年 5 個月
台南市, 台灣
中和區, 新北市, 台灣
新市區, 台南市, 台灣
1.晶圓切割參數優化,調整切割速度搭配輪刀轉速良率上升>10% 2.與供應商共同測試新式切割刀應用新產品上提高客戶投片量 3.量產品異常調查分析,降低人為因素與異物殘留,宣導產線落實SOP手法,使每週異常率小於3次 4.導入新式雷射切割技術,搭配輪刀切割可提高產能>30%,因雷切光束窄增加切割道面積可大幅提高良率>20% • Optimized wafer cutting parameters, adjusted cutting speed and wheel cutter speed to increase yield rate by >10%. • Worked with suppliers to test new cutting knives and applied new products to increase customer wafer output. • Investigated and analyzed mass product abnormalities, reduced human factors and foreign matter residues, and promoted the implementation of SOP techniques in the production line to ensure that the abnormality rate is less than 3 times per week. • Introduced the new laser cutting technology, combined with wheel knife cutting to increase production capacity by >30%, the yield rate can be greatly improved by >20%.

製程工程師

2017年1月 - 2018年7月
1 年 7 個月
台南市, 台灣
1.工研院技轉五軸管材切割技術,雷切機台經調整切割參數搭配雷射光聚焦深淺,不鏽鋼圓管厚度>6mm邊緣處無熔渣,避免二次加工程序降低成本。 2.協助客戶端測試各種不同材料金屬管材,因材料吸收率不同需搭配各自的切割參數,滿足客戶需求。 3.跨部門開發機械手臂搭載光纖雷射,應用於多維度切割自動化。 • Transferred the ITRI's five-axis pipe cutting technology to the laser cutting machine. The cutting parameters are adjusted to match the laser light focusing depth. There is no slag on the edge of the stainless steel round pipe with thickness >6mm, avoiding secondary processing procedures and reducing costs. • Assisted clients to test various metal pipes made of different materials. Due to different material absorption rates, respective cutting parameters need to be matched to meet customer needs.3. Cross-departmental development of a robotic arm equipped with fiber laser for multi-dimensional cutting automation.
Logo of the organization.

開發工程師

2014年11月 - 2017年4月
2 年 6 個月
台南市, 台灣
中和區, 新北市, 台灣
• Developed femtosecond laser to repair bright spot panels through cold processing. The bright spot repair rate achieved >99%. • Jointly developed a laser cleaning machine for ceramic wafer vacuum head with TSMC to restore the adsorption capacity and achieve the surface roughness <1mm. • Customer services behavior: 1. Collaborated on customer machine troubleshooting, actively engaged with software/organization/electronic control colleagues to be on-call to eliminate abnormalities and improved machine availability. 2. Guided clients to test appropriate parameters for new products and provided the good after-sales service to increase purchase willingness. During the tenure, 3 machines were successfully produced.

學歷

Logo of the organization.
碩士學位
電子物理所
2012 - 2014
社團活動
籃球系隊
簡介
使用微影技術製作聚合物探針
Logo of the organization.
理學士(BS)
電子物理
2007 - 2012
社團活動
籃球系隊
簡介
Skills: 製造 · Process Integration · process develop · Semiconductor Fabrication · IC封裝製程 · Processes Development · Manufacturing Process Improvement · 資深 · 飛秒雷射應用 · 光纖雷射源模組化 · 客戶服務 · 華語 · Semiconductor Process · 高功率雷射應用 · 光纖元件製造 · 晶圓切割技術 · 資料分析 · 技術移轉 · 半導體

職場能力評價