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WEI, MIN-AN
EUV Process Intern – Taiwan Semiconductor Manufacturing Company (TSMC)
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WEI, MIN-AN

EUV Process Intern – Taiwan Semiconductor Manufacturing Company (TSMC)
Data-driven materials engineer with hands-on experience in semiconductor process optimization and thin-film metrology. Strong analytical skills built through master’s research on perovskite material recycling and industry training at TSMC’s EUV lithography department. Skilled in precision measurement, process evaluation, and cross-disciplinary problem solving.
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Taiwan Semiconductor Manufacturing Company(TSMC)
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國立清華大學 National Tsing Hua University
台北市, 台灣
台湾

職歴・バックグラウンド

  • 現在の状況
    求職中
  • 専門分野
    Materials Engineer
    Other
  • 業界分野
    半導体
  • 職務年数
    1〜2年 (1年未満 関連経験)
  • 管理経験
    なし
  • スキル
    XRD
    SEM/EDX
    XPS
    ICP-OES
    UV-Vis
    TGA
    Process Control
    Metrology
    Defect Inspection
    Thin-Film Process
    Yield Optimization
    Lithography
    Etching
    OriginPro
    Excel
    PowerPoint
    Process Optimization
    Material Science
    Semiconductor Fabrication
    Semiconductor Process
  • 言語スキル
    Chinese
    母語またはバイリンガル
    English
    流暢
  • 最終学歴
    修士

求職希望

  • 現在の状況
    積極的に転職活動中
  • 希望の雇用形態
    フルタイム
    リモートワークに興味あり
  • 希望職種
    Process Engineer
  • 希望勤務地
    Taiwan
  • フリーランス

職務経験

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EUV Process Intern

7月 2023 - 8月 2023
2 ヶ月
Trained in EUV lithography system operation and exposure control. Conducted process optimization study for mask cleaning and inspection workflow. Proposed cost-down and yield improvement strategy estimated to reduce total cost by 10–15 billion NTD. Collaborated with process engineers and inspection teams to enhance data interpretation and cross-functional communication efficiency.

学歴

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理学修士(MS)
Materials Science
2023 - 2025
説明
Master’s research on perovskite material recycling; thesis titled "Recovering Lead Iodide through a Simple Solvent Method to Promote the Sustainable Development of Perovskite Solar Cells". Relevant coursework included Semiconductor Device Fabrication, Thin Film Technology, Lithography Process, Materials Inspection, Metrology and Defect Analysis. GPA: 3.94 / 4.0 (Top 27.97%).
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理学士(BS)
Materials and Mineral Resources Engineering
2019 - 2023
説明
Bachelor of Science in Materials and Mineral Resources Engineering. GPA: 3.75 / 4.0 (Top 7%).