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Resources
WEI, MIN-AN
EUV Process Intern – Taiwan Semiconductor Manufacturing Company (TSMC)
Data-driven materials engineer with hands-on experience in semiconductor process optimization and thin-film metrology. Strong analytical skills built through master’s research on perovskite material recycling and industry training at TSMC’s EUV lithography department. Skilled in precision measurement, process evaluation, and cross-disciplinary problem solving.
Taiwan Semiconductor Manufacturing Company(TSMC)
國立清華大學 National Tsing Hua University
台北市, 台灣
Taiwan
Professional Background
- Current StatusUnemployed
- ProfessionMaterials Engineer・Other
- FieldsSemiconductor
- Work Experience1-2 years (Less than 1 year relevant)
- ManagementNone
- Skills
- LanguagesChinese・Native or BilingualEnglish・Fluent
- Highest Level of EducationMaster
Job Search Preferences
- Current StatusReady to interview
- Desired Job TypeFull-time・Interested in working remotely
- Desired PositionsProcess Engineer
- Desired Work LocationsTaiwan
- Freelance
Work Experience
EUV Process Intern
Trained in EUV lithography system operation and exposure control. Conducted process optimization study for mask cleaning and inspection workflow. Proposed cost-down and yield improvement strategy estimated to reduce total cost by 10–15 billion NTD. Collaborated with process engineers and inspection teams to enhance data interpretation and cross-functional communication efficiency.
Education
Master of Science (MS)
・
Materials ScienceDescription
Master’s research on perovskite material recycling; thesis titled "Recovering Lead Iodide through a Simple Solvent Method to Promote the Sustainable Development of Perovskite Solar Cells". Relevant coursework included Semiconductor Device Fabrication, Thin Film Technology, Lithography Process, Materials Inspection, Metrology and Defect Analysis. GPA: 3.94 / 4.0 (Top 27.97%).
Bachelor of Science (BS)
・
Materials and Mineral Resources EngineeringDescription
Bachelor of Science in Materials and Mineral Resources Engineering. GPA: 3.75 / 4.0 (Top 7%).