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WEI, MIN-AN
EUV Process Intern – Taiwan Semiconductor Manufacturing Company (TSMC)
Data-driven materials engineer with hands-on experience in semiconductor process optimization and thin-film metrology. Strong analytical skills built through master’s research on perovskite material recycling and industry training at TSMC’s EUV lithography department. Skilled in precision measurement, process evaluation, and cross-disciplinary problem solving.
Taiwan Semiconductor Manufacturing Company(TSMC)
國立清華大學 National Tsing Hua University
台北市, 台灣
台灣
專業背景
- 目前狀態待業中
- 專業材料工程師・其他
- 產業半導體
- 工作年資1 到 2 年 (小於 1 年相關工作經驗)
- 管理經歷無
- 技能
- 語言能力Chinese・母語或雙語English・進階
- 最高學歷碩士
求職偏好
- 目前狀態正在積極求職中
- 預期工作模式全職・對遠端工作有興趣
- 希望獲得的職位Process Engineer
- 期望的工作地點台灣
- 接案服務
工作經驗
EUV Process Intern
Trained in EUV lithography system operation and exposure control. Conducted process optimization study for mask cleaning and inspection workflow. Proposed cost-down and yield improvement strategy estimated to reduce total cost by 10–15 billion NTD. Collaborated with process engineers and inspection teams to enhance data interpretation and cross-functional communication efficiency.
學歷
科學碩士（MS）
・
Materials Science簡介
Master’s research on perovskite material recycling; thesis titled "Recovering Lead Iodide through a Simple Solvent Method to Promote the Sustainable Development of Perovskite Solar Cells". Relevant coursework included Semiconductor Device Fabrication, Thin Film Technology, Lithography Process, Materials Inspection, Metrology and Defect Analysis. GPA: 3.94 / 4.0 (Top 27.97%).
理學士（BS）
・
Materials and Mineral Resources Engineering簡介
Bachelor of Science in Materials and Mineral Resources Engineering. GPA: 3.75 / 4.0 (Top 7%).