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Zi CHEN

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Foxconn 鴻海精密工業
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Aston University
台北市, 台灣
Taiwan

CV Pilihan

Diunggah pada 26 Jan 2026

Latar Belakang Profesional

  • Status sekarang
    Tidak bekerja
  • Profesi
    Hardware Engineer
    Radio Frequency (RF) Engineer
    Electronics Engineer
  • Bidang
    Elektronik / Telekomunikasi
    Hardware
  • Pengalaman Kerja
    6-10 tahun (relevan 4-6 tahun)
  • Management
    Saya berpengalaman mengelola 15+ orang
  • Skil
    Python
    OrCAD Capture
    VNA
    CMW500
  • Bahasa
    Chinese
    Bahasa ibu atau Bilingual
    English
    Profesional
  • Pendidikan tertinggi
    Master

Preferensi pencarian kerja

  • Status sekarang
    Siap untuk wawancara
  • Jenis pekerjaan yang diinginkan
    Full-time
    Tertarik bekerja jarak jauh
  • Jabatan pekerjaan yang diinginkan
    RF工程師
  • Lokasi pekerjaan yang diinginkan
    New Taipei, Taiwan
    Taipei City, Taiwan
  • Bekerja lepas
    Pekerja lepas purna waktu

Pengalaman Kerja

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RF hardware engineer, supervisor

06/2020 - 07/2024
4 yrs 2 mos
Shenzhen, Guangdong Province, People's Republic of China
Ensured products’ cellular communication performance met requirements and complied with 3GPP specifications; Brought multiple products from early NPI stages to mass production. Team Leadership & Project Management ▪︎ Led a 16-engineer team for RFFE integration, achieving outstanding team performance in Apple IDL reviews. ▪︎ Managed resource allocation, task prioritisation, and risk management to ensure on-time milestone delivery. ▪︎ Collaborated with 8+ cross-functional teams and customers to ensure timely issue resolution. ▪︎ Successfully overcame challenges in the 4G to 5G transition within schedule, including RF modem supplier changes, testing platform migration, and integration of new NR, mmWave, and satellite modules. ▪︎ Developed automation tool that reduced RF bench testing cycle time by 25%, earning the 2022 Q2 FX NPI Innovation Award. RF Engineering ▪︎ Verified the performance of RFFE components such as filters, switches, PAs, and LNAs. ▪︎ Performed RF circuits impedance tuning and analysed S-parameters, Smith Charts to meet performance targets. ▪︎ Troubleshot board-level RF Tx/Rx issues, with NPI builds receiving >300 units for team analysis.
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SMT engineer

01/2018 - 04/2020
2 yrs 4 mos
Shanghai, People's Republic of China
Led a 10-engineer team in SMT process development and optimisation to ensure feasibility for mass production. ▪︎ Designed and reviewed SMT fixtures, stencil apertures and transfer trays. ▪︎ Defined and optimised reflow profile, solder printing parameters to prevent and reduce soldering issues. ▪︎ Defined underfill patterns and review underfill strength by cross/planner-section and dye-pry. ▪︎ Developed flow charts, control plans, and standard operating procedures for SMT processes. ▪︎ Resolved the M1 chip solder open issue by optimising stencil aperture, reflow profile, and fixture skybar design, resulting in an improvement of the failure rate from 10% to under 0.01%.

Edukasi

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Magister Ilmu Sains
Engineering Management
2024 - 2025
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Sarjana Teknik
Aerospace engineering
2013 - 2017

Sertifikasi dan Lisensi

Level 7 Certificate in Strategic Management and Leadership Practice

Chartered Management Institute
Credential ID: P05177398
Dibuat 12/2025
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