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CHU-CHIEH HUANG
Over 18 years of experience in the semiconductor industry, working at Winbond Electronics, a memory manufacturer. Initially served as a dry etching equipment engineer and currently holds the position of a dry etching process engineer at the Taichung plant.
Proficient in machine characteristics and dry etching processes: new product process development (DRAM and NAND Flash), anomaly analysis, yield improvement, and execution of various projects.
Equipment experience includes AMAT MESAII, TEL SDRM, LAM CX, and Mattson.
Participated in the construction of Winbond's Taichung plant.
工作經歷
蝕刻製程工程師 • 華邦電子股份有限公司(Winbond)
一月 2016 - Present | Taipei, Taiwan
- Maintained mature processes at Winbond's Taichung plant and implemented methods to enhance product stability and yield improvement.
Upgraded the R2R system to R2R+, significantly improving production inline stability and reducing SAHD count.27 layers Cpk improve over 20%.
Member of the AMC micro-contaminant team, addressing and resolving wafer condensation issues.
Developed standardized production procedures and planned product manufacturing processes.
Established systems for anomaly analysis and monitoring.
Pioneer in PHM/VM analysis, leveraging big data and LASSO modeling to create six fully operational detection models. Collaborated on the PHM project with a professor from National Taiwan University of Science and Technology.
Monitored process equipment and key parameters to ensure optimal performance.
Used professional equipment knowledge to assist colleagues in improving analysis and problem-solving efficiency.
Achieved 4th place in the 5Why competition.
蝕刻設備工程師 • 華邦電子股份有限公司(Winbond)
三月 2005 - 一月 2016 | Taipei, Taiwan
- During the construction phase, completed FAB infrastructure setup and brought it online before equipment move-in.
Established the FDC system for the etching department and implemented special control specifications using calculus and other methods to reduce false alarms. Regularly reviewed software upgrades and incorporated new SVIDs. When SVIDs were unavailable, manually created monitoring and transmission mechanisms, reducing wafer breakage by over 60%.
Collaborated with the process team to optimize the EPD system, utilizing FDC to detect EPD system issues and minimize delays caused by network transmission problems, improving system reliability.
Analyzed Asher scratching issues during the plant's initial phase and won first place in the inaugural Taichung plant QIT competition.
Developed PM (Preventive Maintenance) and TS (Troubleshooting) SOPs.
Secured second place in an internal equipment knowledge-sharing competition.
學歷
大葉大學 DaYeh University
電機工程 • 1999 - 2003
Bachelor of Chemical and Materials Engineering, Da-Yeh University
技能
- JMP
- QIT
- 5 Why/KT
- PHM/VM
- Python
- FDC
- R2R
語言
- Chinese
- English
CHU-CHIEH HUANG
Over 18 years of experience in the semiconductor industry, working at Winbond Electronics, a memory manufacturer. Initially served as a dry etching equipment engineer and currently holds the position of a dry etching process engineer at the Taichung plant.
Proficient in machine characteristics and dry etching processes: new product process development (DRAM and NAND Flash), anomaly analysis, yield improvement, and execution of various projects.
Equipment experience includes AMAT MESAII, TEL SDRM, LAM CX, and Mattson.
Participated in the construction of Winbond's Taichung plant.
工作經歷
蝕刻製程工程師 • 華邦電子股份有限公司(Winbond)
一月 2016 - Present | Taipei, Taiwan
- Maintained mature processes at Winbond's Taichung plant and implemented methods to enhance product stability and yield improvement.
Upgraded the R2R system to R2R+, significantly improving production inline stability and reducing SAHD count.27 layers Cpk improve over 20%.
Member of the AMC micro-contaminant team, addressing and resolving wafer condensation issues.
Developed standardized production procedures and planned product manufacturing processes.
Established systems for anomaly analysis and monitoring.
Pioneer in PHM/VM analysis, leveraging big data and LASSO modeling to create six fully operational detection models. Collaborated on the PHM project with a professor from National Taiwan University of Science and Technology.
Monitored process equipment and key parameters to ensure optimal performance.
Used professional equipment knowledge to assist colleagues in improving analysis and problem-solving efficiency.
Achieved 4th place in the 5Why competition.
蝕刻設備工程師 • 華邦電子股份有限公司(Winbond)
三月 2005 - 一月 2016 | Taipei, Taiwan
- During the construction phase, completed FAB infrastructure setup and brought it online before equipment move-in.
Established the FDC system for the etching department and implemented special control specifications using calculus and other methods to reduce false alarms. Regularly reviewed software upgrades and incorporated new SVIDs. When SVIDs were unavailable, manually created monitoring and transmission mechanisms, reducing wafer breakage by over 60%.
Collaborated with the process team to optimize the EPD system, utilizing FDC to detect EPD system issues and minimize delays caused by network transmission problems, improving system reliability.
Analyzed Asher scratching issues during the plant's initial phase and won first place in the inaugural Taichung plant QIT competition.
Developed PM (Preventive Maintenance) and TS (Troubleshooting) SOPs.
Secured second place in an internal equipment knowledge-sharing competition.
學歷
大葉大學 DaYeh University
電機工程 • 1999 - 2003
Bachelor of Chemical and Materials Engineering, Da-Yeh University
技能
- JMP
- QIT
- 5 Why/KT
- PHM/VM
- Python
- FDC
- R2R
語言
- Chinese
- English