Senior Staff Engineer  •  United Microelectronics Corporation (UMC)

Mar. 2004 - Apr. 2021

It is an honor to have been invited by UMC to join such a world-class company. My journey in the semiconductor industry began in March 2004, when I started working on equipment maintenance in the production line. Four years later, I became the primary person in charge of equipment, gaining valuable experience in troubleshooting, equipment improvement, cost reduction, and yield enhancement. During this period, I was promoted from Engineer to Senior Engineer.

To further enhance my skills, I transitioned to a role related to products—joining the Failure Analysis Engineering Department. There, I acquired extensive expertise in PFA (Physical Failure Analysis) and EFA (Electrical Failure Analysis), mastering techniques such as TEM, SEM, FIB, EDX, Ion Milling, X-ray, and SAT. I also developed proficiency in electrical analysis methods like OBIRCH, EMMI, C-AFM, and Nano probing.

Thanks to these accomplishments, I was promoted and sent to Xiamen, China, in 2016 to participate in overseas factory construction. From planning to execution, I contributed to establishing the facility and served as an on-site instructor, training new engineers. I remained in this role until 2021 when concerns from my family due to the COVID-19 pandemic led me to step down from the position.