. Maintained effective cross-departmental communication to fully understand process specifications. Balanced high bonding precision and high throughput, and finally achieved an accuracy of Cpk ±5µm @ 1.33, with a speed 17% slower than expected. Optical Fiber Endface Inspection | Software Maintenance Optimized OpenCV-based image processing algorithms to meet verification requirements for dirt, scratches, and defects (overkill rates and escape rates). Applied adaptive threshold segmentation, median filtering, morphological operations (opening and closing), and HSV color conversion. Wire-bonding Inspection | Technical Support Developed algorithms for detecting dirt on chips and misalignment between gold balls and
國立台灣大學 (National Taiwan University, NTU)・
生醫電子與資訊學研究所