Ken Chen Thermal Engineer I’m a thermal engineer with 12+ years of hands-on experience in heat transfer, CFD simulation, and IC package/system-level thermal design. My background spans across leading companies such as Alchip, Wistron, Foxconn, and Delta, where I’ve worked on thermal solutions for APs, switches, servers, and advanced IC packaging (2.5D/3DIC, CoWoS). I specialize in: -System & package-level thermal architecture -CFD modeling (Flotherm, ANSYS, 6SigmaET, Celsius) -Cross-functional collaboration (ME, EE, PM, ID, Layout) -Thermal validation and optimization from EVT to MP I enjoy solving complex
Full-time / Interested in working remotely
National Taipei University of Technology・
機械工程學系