主任工程師
日月光半導體製造股份有限公司
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Full-time•Led SiP packaging product development from concept to mass production, successfully launching 10 new products within 4.5 years by optimizing packaging structure and process flow in collaboration with cross-functional teams.
•Coordinated project schedules and resource allocation across departments, enabling customers to accelerate product launch by 6 months, resulting in over NT$100 million in revenue and long-term strategic partnerships.
•Conducted process risk assessments using FMEA methodology and partnered with process engineers and customers to identify optimal solutions for process integration and enhancement.
•Utilized data analytics and AI-based tools to identify root causes of various yield detractors; standardized solutions across platforms, improving product yield to over 99.5%.
•Spearheaded the design and validation of a miniaturized SiP package, reducing product volume by 40% through simulation, feasibility analysis, and prototyping, enhancing product competitiveness.
•Resolved customer quality complaints within 24 hours through swift containment actions and cross-functional root cause investigations; delivered validated solutions within one week to prevent recurrence.