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Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.We are seeking a highly motivated and talented RD Engineer to join our team in developing advanced IC packaging technologies. This position offers an exciting opportunity to work on cutting-edge solutions, such as CoWoS (Chip-on-Wafer-on-Substrate), Fan-Out Wafer Level Packaging (FOWLP), and 3DIC (Three-Dimensional Integrated Circuits). The ideal candidate will have strong technical expertise and a passion for innovation in semiconductor packaging design and analysis.Join us in shaping the future of advanced IC packaging technologies and contributing to groundbreaking innovations in the semiconductor industry. This role provides a unique opportunity to work in a dynamic environment, solve challenging engineering problems, and make a meaningful impact on next-generation packaging solutions.Responsibilities:1. Conduct risk assessments and provide mitigation plans for IC packages through simulation and experiment, interpreting experimental data and simulation to provide insights into material selection and design improvements.2. Practice FEM and DOE in problem solving and path finding particularly on packaging. Conduct mechanical or thermal simulations using finite element analysis (FEA) techniques to evaluate and optimize packaging performance, and analyze stress, deformation, and heat dissipation characteristics to ensure reliability and efficiency of packaging designs.3. Continuously improve simulation methodology, refine material modeling, and enhance script automation capabilities.

1.封裝設計開發 2.研究、評估與建立封裝工程的技術 3.封裝材料的驗證與選用 4.試產、量產時的產品異常分析與改善

製程技術開發與優化1. 研究與導入新製程技術，包括嵌入式銅導線、埋入式無源元件、EMI屏蔽等技術。2. 評估與選定適合的材料（如高導熱介電材料、高可靠性封裝材料等）。3. 設計並驗證新製程方案，確保符合品質與量產要求。4. 新設備/材料評估與導入5. 評估新設備（如激光鑽孔機、選擇性電鍍設備、微細線路製造設備）與新材料的可行性。6. 建立設備參數最佳化與導入標準，確保符合生產需求。7. 與供應商合作進行設備與材料試產測試，推動正式導入。8. 製程良率提升與成本優化9. 監控與分析製程數據，找出良率瓶頸並推動改善專案。10. 訂定 SPC（統計製程管制）方案，確保生產品質穩定。11. 進行 Cost Down 方案，包括材料替代、工序最佳化、自動化導入等。12. 新產品失效分析與可靠性測試13. 建立與優化內埋式製程的失效分析方法，如掃描式電子顯微鏡（SEM）、X-ray、FIB（聚焦離子束）等。14. 制定可靠性測試流程，確保產品符合 AEC-Q100 / Q200 等汽車級認證標準。15. 主導客戶端品質問題處理，提供技術支援與對策方案。16. 跨部門協作與技術文件管理17. 與研發、設備、品保、製造等單位協作，確保製程技術順利導入與量產。18. 撰寫技術報告、標準作業流程（SOP），確保知識累積與可追溯性。19. 培訓生產與品質團隊，確保製程技術正確執行。

1. 新製程開發/新設備,材料評估導入2. 開發先進材料測技術與原理3. 製程良率改善/Cost Down專案/品質問題處理等4. 新產品失效分析流程建立

1. 進行流力、熱流、熱傳的建模分析，或結構應力、應變、疲勞的建模分析2. 電性模擬、量測、優化及相關需求對應3. 熟悉模擬軟體Flotherm/ ANSYS4. 產品前期模擬評估

MAIN PURPOSE OF JOB: - As a key person in process team supporting the project lead working through all the design, implementation and start-up phases of project, have close alignment and collaboration with multiple stakeholders through the project life cycle - The role is to deploy & develop the filling & packing line from either technical center or supplier to meet the project requirements in terms of quality, scope, timing and cost. - Deliver expertise to project in area of filling & packing operation ensuring full compliances, health and safety, product safety and environment are never compromised A DAY IN THE LIFE OF A PROJECT F&P ENGINEER 1. Filling/Packing System Design: - Support Project lead in defining the project scope, goals and deliverables that support business goals in freeze dry filling area. - Work with process user/technical center and design consultant to finalize the required system design (including URS, P&ID and TPM characteristics). - Closely work with draftsman in developing the installation designs (BIM). - Ensure system design fulfill process operation requirement per Nestlé standard. - Create and review specifications of Freeze dry processing and components. - Assure all specifications are feasible to source by connecting to suppliers and manufacturing operations. 2. Project Management: - Support Project lead to create detailed project timelines, budgets, and resource allocation plans. - Identify potential issues and implement corrective actions as necessary. - Be responsible for the overall site filling & packing installation works and monitor the progress. - Manage the day-to-day operations aspects of the project - filling & packing works and support the E&A installation. - Close coordinate with construction streams and startup streams, ensure all the installation designs are fitting to the integrating BIM design and operational requirement, deliver the first-time right installation.3. Lead and manage: - Coordinate with external installation team to ensure a safe and smooth installation execution; resolve any conflict between owner-contractors and among contractors. - Mobilize resources (internal & external) - Execute on freeze dry filling/packing installation and commissioning timely by making sure product and testing quality level is appropriate. 4. Safety and Health: - Implement site HSE protocols to ensure installation work is done is a safe manner and observe all company/governmental regulations. - Promote development of environmental-friendly and sustainable solutions.

As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., we are primarily responsible for package quality and reliability for Micron’s product lines working end to end for DRAM and HBM, provide inputs and approve phase gates, HVM monitoring and dispositions. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced and providing recommendations on product release based on reliability test results. You will also be encouraged to devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues. You will coordinate root cause and corrective action efforts within the GQ department for package related qualification and GCP failures and prepare reports for discussion and escalation. You will also engage in phase gate review starting from design to production release and ensure CTQ compliance and inline validation. Successful candidate for this position will have: Detailed knowledge of semiconductor component package assembly processes and challenges in particularly HBM and 3DS packages. Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies Good understanding of the effects thermo-mechanical, thermal, mechanical, and hygroscopic swelling stresses on package reliability A proven understanding of industry standard reliability test methods, acceleration models used for life predictions, and sampling statistics preferred. Must be self-motivated, able to work independently, and detail oriented. Strong analytical problem-solving skills, excellent multi-tasking skills and the ability to interact easily with other groups. Good written and interpersonal skills, digital literacy are vital. proven understanding of the software systems employed in backend manufacturing and analytics is a plus like MAM, MES, JMP, Tableau etc.